3+2+3
- Number of floors:8L
- Order:3
- Board thickness:1.0mm
- Copper thickness:1oz
- Surface treatment:ENIG + OSP
- Line width and space:3.0mil / 3.0mil
- Application:Communication
- Technical characteristics:Multi-layer heigh plus
? 2020 梅州市志浩電子科技有限公司 版權所有en 粵ICP備10006805號